Euromicro Conference on
Software Engineering and Advanced Applications

August 28 – 30, 2019
Kallithea, Chalkidiki | Greece

SEAA 2019

SEAA 2019 Call For Papers Committees Submissions Registration

Paper Submission Deadline:

1 April 2019

Notification of Acceptance:

6 May 2019

Camera-Ready Papers:

14 June 2019

Call for Papers

Technical Track @ 45th EUROMICRO SEAA Conference in Thessaloniki / Chalkidiki, Greece

Special Session on Software Engineering and Technical Debt in (SEaTeD)

Part of SPPI – Software Process and Product Improvement Track

August 28-30, 2019

Important Dates:

  • Abstract submission to tracks and sessions: March 25, 2019
  • Paper submission to tracks and sessions: April 1, 2019
  • Notification of accepted papers: May 6, 2019
  • Camera-ready paper due: June 3, 2019


In software engineering, the metaphor Technical Debt relates sub-optimal technical solutions to financial debts. Such solutions can have benefits in the short term, but they might create extra-costs (interest) in the future, especially in terms of maintainability and evolvability of the software system. The Technical Debt theoretical framework is useful to translate technical issues into items that can be understood by non-technical stakeholders, who need to evaluate and prioritize the business value of improving internal qualities.

Recently, the Technical Debt metaphor has been developed in the Software Engineering scientific community into a more solid theoretical framework, which has allowed a series of studies and practical approaches. However, there are several open issues with respect to the application of Technical Debt in practice, from its identification to the calculation of the principal (cost of refactoring) and interest. Furthermore, we lack solid evidence on what granularity of information is needed by the stakeholders on their Technical Debt, what can be provided by automatic tools and what needs to be managed manually.

We invite researchers and practitioners to contribute to the special session on the practical and theoretical aspects of the Technical Debt. We especially welcome empirical studies and industrial experiences.

The topics of interest include, but are not limited to:

  • Case-studies on (un)successful Technical Debt management
  • Case-studies on (un)successful refactoring of Technical Debt
  • Evidence of Principal and Interest of specific kinds of Technical Debt
  • Frameworks for the estimation of Principal and Interest
  • Stakeholders concerns and architecture viewpoints on Technical Debt
  • Measurement frameworks to study the components of Technical Debt
  • Decision frameworks for prioritizing Technical Debt items among themselves and against features
  • Methods and tools for monitoring Technical Debt
  • Processes for managing Technical Debt in software companies
  • Organizational implications of Technical Debt Management
  • Architectural Technical Debt
  • Less studied kinds of Technical Debt: Requirement, Test, Documentation, Infrastructure Debt
  • Social Debt and its impact on Technical Debt
  • Technical Debt in embedded systems
  • Relationships between Technical Debt in software development and other interacting disciplines (e.g. electrical-, mechanical engineering, etc.)
  • Comparison and relationships between Technical Debt and other topics (e.g. sustainability, DevOps, etc.)
  • Replication studies on Technical Debt


SEaTeD special session will follow the general SEAA 2019 submission guidelines. The conference proceedings in the last years have been published by the IEEE Computer Society. The format is the IEEE two-column proceedings format (8 pages for full papers and 4 pages for short papers). Submission will be handled via EasyChair (; please find general submission information for SEAA on the conference homepage (

Please note that it is planned to select best papers among all tracks of SEAA and present them with an award. A selection of best papers will be invited to submit extended versions for tentative publication in a requested Special Issue of a Journal (under negotiation).

We encourage submission of technical research papers (4-8 pages) and experience reports (4-8 pages). Papers must contain original unpublished work, describe significant novel contributions, and provide evidence on the validation of results. In particular, reports on industrial applications are welcome. We welcome also theoretical work for which empirical validation is limited or still in progress, provided that the contribution is particularly novel and clearly oriented towards its practical application.

Special Session Organizers:
Antonio Martini, University of Oslo, Norway
Apostolos Ampatzoglou, University of Macedonia,Greece
Alexander Chatzigeorgiou, University of Macedonia, Greece

Program Committee

Apostolos Ampatzoglou, University of Macedonia

Areti Ampatzoglou, University of Groningen

Francesca Arcelli, Fontana University of Milano Bicocca

Maria-Elvira Arvanitou, University of Macedonia, Greece

Rami Bahsoon, School of Computer Sc, University of Birmingham

Ayse Bener, Ryerson University

Terese Besker, Chalmers University of Technology

Jan Bosch, Chalmers University of Technology

Frank Buschmann, Siemens AG

Alexander Chatzigeorgiou, Dept. of Applied Informatics, University of Macedonia

Zadia Codabux, Colby College

Steven Fraser, Innoxec

Alfredo Goldman, University of São Paulo

Javier Gonzalez Huerta, Blekinge Tekniska Högskola

Christine Hofmeister, East Stroudsburg University

Johannes Holvitie ,University of Turku

Clemente Izurieta, Montana State University

Heiko Koziolek, ABB Corporate Research

Philippe Kruchten, The University of British Columbia

Valentina Lenarduzzi, Tampere University, Finland

Ville Leppänen, University of Turku, Department of Future Technologies

Jean-Louis Letouzey, inspearit

Leon Moonen, Simula Research Laboratory

Ipek Ozkaya, Carnegie Mellon Software Engineering Institute

Fabio Q. B. Da Silva, Federal University of Pernambuco

Klaus Schmid, University of Hildesheim

Carolyn Seaman, UMBC

Andriy Shapochka, SoftServe Inc.

Dag Sjøberg, Department of Informatics, University of Oslo

Will Snipes, ABB Corporate Research

Kari Systä, Tampere University of Technology

Amjed Tahir, Massey University

Davide Taibi, Tampere University of Technology, Finland

Damian Andrew Tamburri, Politecnico di Milano

Graziela Tonin, Ufpe

Guilherme Travassos, COPPE/UFRJ

Aiko Yamashita, Oslo and Akershus University College of Applied Sciences

Uwe Zdun, University of Vienna